...

Electronic board assembly

Production

innovation

EXPERIENCE AND OPTIMIZATION

With our team’s mix of experience and expertise over the years, we carefully select the most appropriate components to minimize material costs and procurement time. All with a focus on the quality and reliability of each element.

Development

HOW THE ASSEMBLY TAKES PLACE ELECTRONIC BOARDS

SMT assembly

Samec uses state-of-the-art in-line machinery forelectronic board assembly and SMT component soldering using forced-air furnaces or alternatively Vapor Phase for melting.
High-tech Pick&Place machines are the beating heart of this precision process, allowing very small components to be placed on either side of the PCB and resulting in a small electronic board. In the SMT Process, each electronic circuit is also subjected to optical inspection with an automated system to detect any minor inaccuracies-AOI testing.

Mounting THT

All production involving components that require manual assembly is carried out by specialized personnel coordinated by our technical department. Welding techniques can be manual or with wave welders.

Electromechanics

Samec can also assist the customer in the case of complex assembly of electronic boards with electromechanical components by offering a finished product ready for sale.

Vacuum method

WELDING VAPOR PHASE

The vapor phase remelting system, Vapor Phase, is based on the physical laws of heat transfer by steam and in the absence of air, in a vacuum.

This type of process guarantees unprecedented quality; it is the most precise soldering possible forelectronic board assembly.
In fact, Vapor Phase turns out to be the best technology for soldering complex components such as BGA, QFP, QFN, POP, in densely populated boards with a wide variety of components.
In addition, Vapor Phase vacuum soldering is optimal in devices where thermal transmission is required for heat dissipation. In fact, in this way the presence of Void or critical bubbles in the weld is reduced by 99%.

Final stage

THE POST ASSEMBLY

Inspections and Testing

Quality controls occur throughout the electronic board assembly process. AOI, Automated Optical Inspection, is a sophisticated welding and positioning verification machine; while for more accurate inspection we use X-Ray technology.
The electronic boards produced can also be tested upon request with 100% inspection by our testers with ad hoc test benches. The whole company follows the philosophy of Total Quality Management (TQM).

Finishes and Tropicalizations

Depending on the type of application and the conditions under which your electronic board will be used, we can offer different treatments. You can choose ultrasonic washing, oven drying, selective coatings, conformal coating, and immersion resin coatings. The best finishes will be studied in order to ensure maximum efficiency of your product even in the harshest environmental and climatic conditions.

Contact

DO YOU HAVE AN IDEA TO IMPLEMENT?

Electronic board assembly
Seraphinite AcceleratorOptimized by Seraphinite Accelerator
Turns on site high speed to be attractive for people and search engines.